• DocumentCode
    3621150
  • Title

    Characterization of bonded wafer for RF filters with reduced TCF

  • Author

    B.P. Abbott;J. Chocola;K. Lin;N. Naumenko;J. Caron

  • Volume
    2
  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    926
  • Lastpage
    929
  • Keywords
    "Wafer bonding","Radio frequency","Filters","Surface acoustic waves","Silicon","Temperature","Lithium compounds","Glass","Capacitance","Resonant frequency"
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2005 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-9382-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2005.1603002
  • Filename
    1603002
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3621150