• DocumentCode
    3621241
  • Title

    Low temperature bonding of interface acoustic waves resonators on silicon wafers

  • Author

    H. Majjad;V. Laude;S. Ballandras

  • Volume
    2
  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    1307
  • Lastpage
    1310
  • Keywords
    "Temperature","Wafer bonding","Acoustic waves","Silicon","Frequency","Surface acoustic wave devices","Lithium niobate","Surface acoustic waves","Surface contamination","Finite element methods"
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2005 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-9382-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2005.1603093
  • Filename
    1603093
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3621241