• DocumentCode
    3624070
  • Title

    Current Challenges in Cu Electromigration Reliability

  • Author

    Christine Hau-Riege

  • Author_Institution
    AMD
  • fYear
    2006
  • Firstpage
    217
  • Lastpage
    217
  • Keywords
    "Electromigration","Niobium compounds","Titanium compounds","Electronic design automation and methodology","Negative bias temperature instability","CMOS technology","Integrated circuit reliability","Integrated circuit interconnections"
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2006 IEEE International
  • ISSN
    1930-8841
  • Print_ISBN
    1-4244-0296-4
  • Electronic_ISBN
    2374-8036
  • Type

    conf

  • DOI
    10.1109/IRWS.2006.305256
  • Filename
    4098733
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3624070