DocumentCode :
3624075
Title :
IIRW 2006 Discussion Group Summary : Product Reliability
fYear :
2006
Firstpage :
222
Lastpage :
222
Keywords :
"Semiconductor device reliability","Semiconductor device packaging","Semiconductor device testing","Vibration control","Reliability engineering","Passivation","Earth Observing System","Wire","Wafer bonding","Silicides"
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2006 IEEE International
ISSN :
1930-8841
Print_ISBN :
1-4244-0296-4
Electronic_ISBN :
2374-8036
Type :
conf
DOI :
10.1109/IRWS.2006.305261
Filename :
4098738
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3624075
