Title :
Inverse damage detection in IC packaging component
Author :
Chun-Yin Wu; Wen-Chang Lin
Author_Institution :
Department of Mechanical Engineering, Tatung University, Taipei, 104, Taiwan
Keywords :
"Integrated circuit packaging","Mechanical engineering","Cities and towns","Printing","Publishing"
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451780
