Title :
The influence of process parameters and materials properties on stress distribution in MEMS - ASIC integrated systems after molding - numerical and experimental approach
Author :
T. Falat;K. Friedel;K. Malecki;D. Uruska;W. Gal
Author_Institution :
Wroc?aw University of Technology, Faculty of Microsystem Electronics and Photonics, ul.Janiszewskiego 11/17, 50-372, Poland
fDate :
4/1/2009 12:00:00 AM
Abstract :
The paper focuses on influence of materials properties and molding processes parameters on warpage of bimaterial silicon-molding compound (MC) systems. The three different MCs of different glass transition temperature Tg and different coefficients of thermal expansion (CTE) were considered in numerical and experimental investigation. The post molding processes and their influence on warpage were analyzed. The paper reports results of several warpage measurement experiments and FEM (finite element method) analysis, performed in frame of European Project DAVID (downscaled assembly of vertically interconnected devices).
Keywords :
"Material properties","Micromechanical devices","Application specific integrated circuits","Thermal stresses","Glass","Temperature","Thermal expansion","Finite element methods","Performance analysis","Performance evaluation"
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Print_ISBN :
978-1-4244-4159-4;978-1-4244-4160-0
DOI :
10.1109/ESIME.2009.4938440
