3631719

Professional development courses for the 59^th ECTC

2009

"Lead","Environmentally friendly manufacturing techniques","Semiconductor device packaging","Photonics","Integrated circuit packaging","Wafer scale integration","Electronics packaging","Components, packaging, and manufacturing technology","Components, Packaging, and Manufacturing Technology Society","Continuing education"

ieee

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

0569-5503

978-1-4244-4475-5

2377-5726

conf

10.1109/ECTC.2009.5073979

5073979