Title :
Sensitivity of output response to geometrical dimensions in VLSI interconnects
Author :
Agnieszka Ligocka-Wardzinska;Wojciech Bandurski
Author_Institution :
Poznan University of Technology, Poland
Abstract :
The paper presents a sensitivity analysis of step and ramp response of VLSI interconnects to geometrical dimensions of microstrip model of higher level interconnects. The method is based on analytical form of VLSI output response calculated using multiple scales method.
Keywords :
"Very large scale integration","Integrated circuit interconnections","Solid modeling","Inductance","Microstrip","Impedance","Power transmission lines","Differential equations","Power system interconnection","Paper technology"
Conference_Titel :
Signal Propagation on Interconnects, 2009. SPI ´09. IEEE Workshop on
Print_ISBN :
978-1-4244-4490-8
DOI :
10.1109/SPI.2009.5089863
