• DocumentCode
    3633244
  • Title

    The design and improvement of LTCC-based capacitive pressure sensors employing finite element analysis

  • Author

    Ciprian Ionescu;Paul Svasta;Cristina Marghescu;Marina Santo Zarnik;Darko Belavic

  • Author_Institution
    University ?Politehnica? of Bucharest, Center for Technological Electronics and Interconnection Techniques, Spl. Independentei 313, 060042-Bucharest, Romania
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In recent years there was a raising interest in capacitive sensors. Their rate on today´s sensor market is steadily rising due to the decreasing of the technology cost, their stability and the employment of simple conditioning circuits interfacing. These sensors can be used to measure a wide variety of physical quantities: flow, pressure, liquid level and others. The capacitive pressure sensors this paper focuses on are constructed on a LTCC base with a circular edge-clamped diaphragm (membrane) overlapped to a ring fixed on the substrate. Assembled this structures form a cylindrical chamber. One of the electrodes is deposited on the bottom side of the membrane; the other is placed opposite - directly on the substrate. Changes of the distance between the electrodes, which appear as a result of an applied pressure, imply a change in capacitance. A few samples of this sensor have been produced and characterized. In the construction of this sensor materials with different characteristics are used (LTCC Du Pont 951, AgPd, brass). A virtual model of the sensor was consequently developed using ANSYS. The results of the performed measurements were compared with the simulated ANSYS model. Changes in design and their influence on the sensitivity and reliability of the sensor have been implemented as well. The aim of this paper is to introduce the finite element model and some of the ways this model can be used to improve the performances of the sensor by optimizing its design.
  • Keywords
    "Capacitive sensors","Finite element methods","Sensor phenomena and characterization","Biomembranes","Electrodes","Costs","Circuit stability","Employment","Fluid flow measurement","Pressure measurement"
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference, 2009. EMPC 2009. European
  • Print_ISBN
    978-1-4244-4722-0
  • Type

    conf

  • Filename
    5272869