Influence of mechanical stress and temperature aging on a change of electrical connection resistance

This article deals with the mechanical stress and the temperature aging of the lead and lead free soldered joints. Soldered joints have influence on a total quality of electronic assembly. Mechanical and temperature tests are mainly used for resistance evaluation of components, devices and whole products against stress. This stress takes effect during function, transport and storage of the devices. Mechanical stress and temperature aging can change electrical properties of the soldered joints, e.g. electrical resistance. Even a small change of the electrical resistance could cause the malfunction of the electrical equipment. This is especially in the case of electrical equipment with high current density. In this article, the changes of the electrical resistance of mechanically stressed and temperature aged soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) are compared.