• DocumentCode
    3633302
  • Title

    Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints

  • Author

    A. Pietrikova;P. Mach;J. Durisin;E. Livovsky;J. Urbancik

  • Author_Institution
    Faculty of Electrical Engineering and Informatics, Technical University of Kosice, Letna 9, 042 00 Kosice, Slovakia
  • fYear
    2008
  • Firstpage
    363
  • Lastpage
    366
  • Abstract
    The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation of microstructure development of the solder, solder/PCB pad interface and on the measurement of the solder joints nonlinearity of the current-voltage (C-V) characteristics. The microstructure is evaluated before and after accelerated ageing.
  • Keywords
    "Microstructure","Phase measurement","Soldering","Environmentally friendly manufacturing techniques","Lead","Printed circuits","Surface finishing","Current measurement","Capacitance-voltage characteristics","Accelerated aging"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE ´08. 31st International Spring Seminar on
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4244-3973-7;978-1-4244-3972-0
  • Electronic_ISBN
    2161-2064
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276669
  • Filename
    5276669
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3633302