Title :
New methodology on electro-thermal characterization and modeling of large power drivers using lateral PNP BJTs
Author :
J. Rhayem;A. Vrbicky;R. Blečić;P. Malena;S. Bychikhin;D. Pogany;A. Wieers;A. Barić;M. Tack
Author_Institution :
ON Semiconductor Belgium BVBA, Westerring 15, B-9700 Oudenaarde, Belgium
fDate :
4/1/2010 12:00:00 AM
Abstract :
This paper presents a new methodology to characterize and simulate the electro-thermal aspects of packaged power drivers using lateral bipolars. Maximum elevation of junction temperature due to the electrical power stress is sensed in the field of the drivers. Those measurements are further complemented by the transient interferometric mapping (TIM) inspection. For the first time a data driven segmented electro-thermal model is proposed to describe accurately the non-uniform current density and the thermal profile behavior of a large power driver.
Keywords :
"Packaging","Temperature sensors","Thermal stresses","Inspection","Current density"
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Print_ISBN :
978-1-4244-7026-6
DOI :
10.1109/ESIME.2010.5464596