Advanced ESD power clamp design for SOI FinFET CMOS technology

Two novel ESD power clamp design techniques for SOI FinFET CMOS technology are reported. First, a layout improvement technique is discussed for stacked gated diodes, which reduces the required area for a given ESD robustness and at the same time reduces the on-resistance of the clamp. Secondly, circuit design techniques are used to convert a standard RC-triggered active ESD clamp into a bi-directional design, thereby alleviating the need for a separate reverse protection diode. The concepts can be applied for planar SOI as well.