• DocumentCode
    3638131
  • Title

    Thermal evaluation of the quality of electrically conductive adhesive joints

  • Author

    Václav Papez;David Bušek

  • Author_Institution
    Department of Electrotechnology, Faculty of Electrical Engineering Czech Technical University, Prague 6, 166 27, Czech Republic
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper deals with electrically conductive adhesives and an innovative quality estimation method based on thermal field evaluation. The resistance of joints heated by passing current can be roughly estimated by the use of temperature field picture. Methodology of calculation of the resistance of the joint, based on a temperature curve across the component is presented.
  • Keywords
    "Joints","Temperature measurement","Heating","Temperature sensors","Electrical resistance measurement","Thermal resistance"
  • Publisher
    ieee
  • Conference_Titel
    Applied Electronics (AE), 2010 International Conference on
  • ISSN
    1803-7232
  • Print_ISBN
    978-80-7043-865-7
  • Type

    conf

  • Filename
    5599640