DocumentCode
3638131
Title
Thermal evaluation of the quality of electrically conductive adhesive joints
Author
Václav Papez;David Bušek
Author_Institution
Department of Electrotechnology, Faculty of Electrical Engineering Czech Technical University, Prague 6, 166 27, Czech Republic
fYear
2010
Firstpage
1
Lastpage
4
Abstract
This paper deals with electrically conductive adhesives and an innovative quality estimation method based on thermal field evaluation. The resistance of joints heated by passing current can be roughly estimated by the use of temperature field picture. Methodology of calculation of the resistance of the joint, based on a temperature curve across the component is presented.
Keywords
"Joints","Temperature measurement","Heating","Temperature sensors","Electrical resistance measurement","Thermal resistance"
Publisher
ieee
Conference_Titel
Applied Electronics (AE), 2010 International Conference on
ISSN
1803-7232
Print_ISBN
978-80-7043-865-7
Type
conf
Filename
5599640
Link To Document