Title :
Recent advance in solder ball interconnections reliability examination
Author :
Olga Švecová;Michal Nicák;Petr Kosina;Josef Šandera
Author_Institution :
Department of Microelectronics, Brno University of Technology, Czech Republic
fDate :
5/1/2011 12:00:00 AM
Abstract :
This article describes recent advance in research of reliability of lead-free (SAC 305) ball interconnections between electronic modules and base printed circuit boards. Alternative methods such as finite element method, which is being widely used in simulation software Ansys and by Coffin-Manson´s fatigue model. Recent calculations concur to statistic-based evaluation of earlier experiments, which proved greater reliability of solder joints created on alumina substrates.
Keywords :
"Soldering","Mathematical model","Fatigue","Reliability","Stress","Computational modeling","Finite element methods"
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Print_ISBN :
978-1-4577-2111-3
Electronic_ISBN :
2161-2536
DOI :
10.1109/ISSE.2011.6053868
