DocumentCode :
3646256
Title :
Microfluidic platforms realized by micromachining and anodic bonding of Si and glass substrates
Author :
D. Resnik;U. Aljančič;D. Vrtačnik;M. Možek;B. Pečar;S. Amon
Author_Institution :
University of Ljubljana, Faculty of Electrical Engineering, Laboratory of Microsensor Structures and Electronics, Trž
fYear :
2012
fDate :
3/1/2012 12:00:00 AM
Firstpage :
1
Lastpage :
4
Abstract :
Presented work focuses mainly on issues accompanied with defect free anodic bonding of multilayer glass-Si-glass microfluidic structures. The problems associated with prefabricated structures which included micromachined or patterned topography on one or both of the mating surfaces and bonding to SiO2 terminated Si were investigated. In this study, Pyrex 7740 and Borofloat 33 glass wafers were bonded to bare Si and Si/SiO2 terminated structures in the temperature range 350-400°C in the air ambient under applied anodic voltages between 800-1200V. Appropriate configuration of bonding electrodes was found mandatory to avoid debonding effects in multilayer bonding process. Wet etching of glass was used to fabricate microchannels and recessed structures in glass, which were subsequently anodically bonded to the cover glass via different intermediate layers. Thin intermediate Al layer was found to provide very uniform and stable bond between two glass wafers.
Keywords :
"Glass","Bonding","Silicon","Substrates","Surface treatment","Microfluidics","Microchannel"
Publisher :
ieee
Conference_Titel :
Devices, Circuits and Systems (ICCDCS), 2012 8th International Caribbean Conference on
ISSN :
2165-3542
Print_ISBN :
978-1-4577-1116-9
Electronic_ISBN :
2165-3550
Type :
conf
DOI :
10.1109/ICCDCS.2012.6188939
Filename :
6188939
Link To Document :
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