Author :
I. Stanimirović;Z. Stanimirović
Author_Institution :
IRITEL A.D. Belgrade, Batajnič
fDate :
5/1/2012 12:00:00 AM
Abstract :
Over the last few years MEMS technology has demonstrated high potential for realizing essential components for modern engineering systems. However, our knowledge of reliability issues relevant to MEMS growing is still insufficient. This paper provides a brief overview of MEMS technologies and generic structures as well as failure mechanisms that are commonly encountered.
Keywords :
"Micromechanical devices","Reliability","Packaging","Substrates","Surface treatment","Stress"
Conference_Titel :
Microelectronics (MIEL), 2012 28th International Conference on
Print_ISBN :
978-1-4673-0237-1
DOI :
10.1109/MIEL.2012.6222826
