Comparison between two Surface Insulation Resistance tests regarding different soldering techniques

The paper shows the results of a second approach of the Surface Insulation Resistance (SIR) test performed in order to test the quality of solder pastes. The aim of the SIR test was to establish the influence of the reflow method used and of a protective coating on the SIR. At the end of this test, a comparison between the obtained results was done. Both tests were done in the conditions of environment heat and high humidity. The boards used in both experiments are special designed test pattern boards (IPC-B-24) and the no-clean solder pastes are the following: SAC305, SN100C, SN100C-XF3 OM338PT, OM5300 [1]. The measurements of the SIR values showed better results keeping in mind that this was the second experiment and that we gained experience during the first experiment.