DocumentCode :
3650673
Title :
Professional development courses for the 63rd ECTC
fYear :
2013
Firstpage :
1
Lastpage :
1
Keywords :
"Integrated circuit modeling","Electronics packaging","Educational institutions","Semiconductor device reliability","Packaging","Continuing education"
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
ISSN :
0569-5503
Print_ISBN :
978-1-4799-0233-0
Type :
conf
DOI :
10.1109/ECTC.2013.6575535
Filename :
6575535
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3650673
