DocumentCode :
3653590
Title :
Reliability characterization of a commercial TaOx-based ReRAM
Author :
Jean Yang-Scharlotta;Megan Fazio;Mehran Amrbar;Mark White;Douglas Sheldon
Author_Institution :
Jet Propulsion Laboratory, Caltech, NASA, Pasadena, California
fYear :
2014
Firstpage :
131
Lastpage :
134
Abstract :
We present results of endurance and retention characterization for one of the first commercially available TaOx-based resistive memory chip in room and higher temperature environments. Data retention of the memory chip shows activation energy of 1.13eV and demonstrates an 85°C 10-year data retention even after 250,000 programming cycles. The combined program and read errors were in the range of 10-7 to 10-5 and the memory chip withstood 106 program cycles at 125°C. Overall, the reliability of this commercial resistive memory chip compares well with flash memory.
Keywords :
"Computer architecture","Flash memories","Microprocessors","Error analysis","Reliability","Temperature distribution","Writing"
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
Print_ISBN :
978-1-4799-7308-8
Type :
conf
DOI :
10.1109/IIRW.2014.7049528
Filename :
7049528
Link To Document :
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