An energy efficient and low cross-talk CMOS sub-THz I/O with surface-wave modulator and interconnect

Free-space EM-wave based GHz interconnect has significant loss and crosstalk that cannot be deployed as low-power and dense I/Os for future network-on-chip (NoC) integration of many-core and memory. This paper proposes an energy-efficient and low-crosstalk sub-THz (0.1T-1T) I/O with use of surface-wave based modulator and interconnects in CMOS. By introducing sub-wavelength periodical corrugation structure onto transmission line, the surface-wave is established to propagate signal that is strongly localized on surface of top-layer metal wire, which results in low coupling into lossy substrate and neighboring metal wires. As such, significant power saving and cross-talk reduction can be observed with high communication bandwidth. In addition, a high on/off-ratio surface-wave modulator is also proposed to support on-chip THz communication. As designed in 65nm CMOS, the results have shown that the proposed surface-wave I/O interface achieves 25Gbps data rate and 0.016pJ/bit/mm energy efficiency at 140GHz carrier frequency over 20mm surface-wave channels. They can be placed with 2.4μm channel spacing and a -20dB crosstalk ratio. The surface-wave modulator also achieves significant reduction of radiation loss with 23dB extinction ratio.