DocumentCode
3667946
Title
Simulation of TaOX -RRAM with Ta2 O5−X /TaO2−X stack engineering
Author
Y.D. Zhao;P. Huang;Z. Chen;C. Liu;H.T. Li;W.J. Ma;B. Gao;X.Y. Liu;J.F. Kang
Author_Institution
Institute of Microelectronics, Peking University, Beijing, China
fYear
2015
Firstpage
285
Lastpage
288
Abstract
An atomistic Monte-Carlo simulator of TaOX-based resistive random access memory (RRAM) with bi-layered Ta2O5-X/TaO2-X stack is developed by considering generation/recombination (G-R) of oxygen vacancies (VO) with oxygen ions (O2-), phase transition (P-T) between Ta2O5 and TaO2 as well as interactions of Ta2O5-X/TaO2-X stack. The stack induced effects involving changeable Schottky barrier (SB) at the stack interface, the evolutions of O2- and lattice oxygen (LO) in the stack and the self-compliance effect are also included in the simulator. Using the simulation tool, the resistive switching (RS) characteristics of the bi-layered TaOX-based RRAM can be reproduced. The impacts of different stack thicknesses, oxygen contents and capabilities to take redox reactions with O2- of TaO2-X layer on RS behaviors are simulated. The simulation results can be utilized to achieve controllable switching processes and optimized device performances.
Keywords
"Resistance","Switches","Monte Carlo methods","Degradation","Schottky barriers","Current measurement","Voltage measurement"
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
ISSN
1946-1569
Print_ISBN
978-1-4673-7858-1
Type
conf
DOI
10.1109/SISPAD.2015.7292315
Filename
7292315
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