• DocumentCode
    3667946
  • Title

    Simulation of TaOX-RRAM with Ta2O5−X/TaO2−X stack engineering

  • Author

    Y.D. Zhao;P. Huang;Z. Chen;C. Liu;H.T. Li;W.J. Ma;B. Gao;X.Y. Liu;J.F. Kang

  • Author_Institution
    Institute of Microelectronics, Peking University, Beijing, China
  • fYear
    2015
  • Firstpage
    285
  • Lastpage
    288
  • Abstract
    An atomistic Monte-Carlo simulator of TaOX-based resistive random access memory (RRAM) with bi-layered Ta2O5-X/TaO2-X stack is developed by considering generation/recombination (G-R) of oxygen vacancies (VO) with oxygen ions (O2-), phase transition (P-T) between Ta2O5 and TaO2 as well as interactions of Ta2O5-X/TaO2-X stack. The stack induced effects involving changeable Schottky barrier (SB) at the stack interface, the evolutions of O2- and lattice oxygen (LO) in the stack and the self-compliance effect are also included in the simulator. Using the simulation tool, the resistive switching (RS) characteristics of the bi-layered TaOX-based RRAM can be reproduced. The impacts of different stack thicknesses, oxygen contents and capabilities to take redox reactions with O2- of TaO2-X layer on RS behaviors are simulated. The simulation results can be utilized to achieve controllable switching processes and optimized device performances.
  • Keywords
    "Resistance","Switches","Monte Carlo methods","Degradation","Schottky barriers","Current measurement","Voltage measurement"
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2015 International Conference on
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-7858-1
  • Type

    conf

  • DOI
    10.1109/SISPAD.2015.7292315
  • Filename
    7292315