Fatigue analysis of IC packaging

Computer simulation was used to examine the fundamental behavior of the fatigue in IC packaging systems with considerable saving of time and resources. The simulation allowed the study of some parameters and physical and structural phenomena, such as: total deformation, elastic equivalent strain, equivalent stress and fatigue. A model was developed to perform the simulation with a thermal cycle from -40°C to 85°C. The SN curve of the analyzed materials was used to derive the fatigue of the structure. The analyzed materials were structural steel and 63%Sn37%Pb solder alloy.