• DocumentCode
    3676334
  • Title

    Incorporation of active RF circuit elements into additively manufactured substrates

  • Author

    Isaac Ehrenberg;Sanjay Sarma;Thomas Steffen;Bae-Ian Wu

  • Author_Institution
    Lab for Manufacturing and Productivity, Massachusetts Institute of Technology, Cambridge, USA
  • fYear
    2015
  • fDate
    7/1/2015 12:00:00 AM
  • Firstpage
    611
  • Lastpage
    612
  • Abstract
    Additive Manufacturing processes have matured in recent years and are now being applied to the rapid fabrication of functional electromagnetic structures and devices such as waveguides, antennae, and metamaterials. Key to a successful breakthrough into commercial viability for the industry is the incorporation of active RF elements. In this paper, we note some of the difficulties associated with including active elements within additively manufactured substrate designs, and report measurements from a microstrip transmission line with its transmission tuned by a voltage controlled analog phase shifter embedded within a 3D printed substrate. The results indicate that while active elements can be incorporated, performance could be improved by certain design and fabrication changes.
  • Keywords
    "Substrates","Phase shifters","Additives","Radio frequency","Copper","Fabrication","Transmission line measurements"
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation & USNC/URSI National Radio Science Meeting, 2015 IEEE International Symposium on
  • Type

    conf

  • DOI
    10.1109/APS.2015.7304692
  • Filename
    7304692