DocumentCode
3676334
Title
Incorporation of active RF circuit elements into additively manufactured substrates
Author
Isaac Ehrenberg;Sanjay Sarma;Thomas Steffen;Bae-Ian Wu
Author_Institution
Lab for Manufacturing and Productivity, Massachusetts Institute of Technology, Cambridge, USA
fYear
2015
fDate
7/1/2015 12:00:00 AM
Firstpage
611
Lastpage
612
Abstract
Additive Manufacturing processes have matured in recent years and are now being applied to the rapid fabrication of functional electromagnetic structures and devices such as waveguides, antennae, and metamaterials. Key to a successful breakthrough into commercial viability for the industry is the incorporation of active RF elements. In this paper, we note some of the difficulties associated with including active elements within additively manufactured substrate designs, and report measurements from a microstrip transmission line with its transmission tuned by a voltage controlled analog phase shifter embedded within a 3D printed substrate. The results indicate that while active elements can be incorporated, performance could be improved by certain design and fabrication changes.
Keywords
"Substrates","Phase shifters","Additives","Radio frequency","Copper","Fabrication","Transmission line measurements"
Publisher
ieee
Conference_Titel
Antennas and Propagation & USNC/URSI National Radio Science Meeting, 2015 IEEE International Symposium on
Type
conf
DOI
10.1109/APS.2015.7304692
Filename
7304692
Link To Document