Title :
Modular thermal design approach for semiconductor modules in power electronic converters
Author :
Artjom Gruber;Matthias Rehbein;Klaus Rigbers;Kirsten Stiebler
Author_Institution :
SMA SOLAR TECHNOLOGY AG, Sonnenallee 1, 34266 Niestetal, Germany
Abstract :
This paper presents a new modular approach for the thermal design of semiconductor power modules that serves to determine the number and size of the power semiconductor chips, the used packaging technology and the heat sink design at an early stage of the design process. As in various applications like for example photovoltaic inverters the thermal design is mainly dependent upon the worst case stationary operation conditions, the model refers to the static thermal behavior of the system only. It consists of three parts: first, a 2D simulation based calculation of the thermal resistance between the semiconductor chips and the heat sink, second, an analytic model for designing forced air cooled heat sinks and last, a routine for suitable combination of modules and heat sinks.
Keywords :
"Heat sinks","Three-dimensional displays","Solid modeling","Thermal resistance","Resistance heating","Thermal conductivity"
Conference_Titel :
Power Electronics and Applications (EPE´15 ECCE-Europe), 2015 17th European Conference on
DOI :
10.1109/EPE.2015.7309149