• DocumentCode
    3679832
  • Title

    Integration technologies for a medium voltage modular multi-level converter with hot swap capability

  • Author

    Didier Cottet;Francesco Agostini;Thomas Gradinger;Rudi Velthuis;Bernhard Wunsch;David Baumann;Willi Gerig;Andrea Rüetschi;Dacfey Dzung;Harald Vefling;Anne Elisabeth Vallestad;Dalimir Orfanus;Reidar Indergaard;Tormod Wien;Wim van der Merwe

  • Author_Institution
    ABB Switzerland Ltd., Corporate Research 5405 Baden-Dä
  • fYear
    2015
  • Firstpage
    4502
  • Lastpage
    4509
  • Abstract
    Recent development in modular converter topologies have raised the discussion about exploiting the inherent redundancy of such converters in order to maximize their availability. One such solution involves the replacement of power electronic building blocks (PEBBs) during operation, a procedure also referred to as `hot swap´. Hot swap is considered as state-of-the-art in today´s IT systems and low voltage power supplies. At medium voltage however, hot swap is getting more demanding, mainly because of the higher voltages and because of the often series connected PEBBs. In this paper we therefore present dedicated integration technologies addressing the required pluggability and insulation of PEBBs, and therefore enabling hot swap at medium voltage. The technologies developed cover auxiliary power supply, cooling, communication and insulation, and are demonstrated under real conditions in a full scale medium voltage concept converter. Hot swap was successfully demonstrated at a DC-link voltage of 3.4 kV, an output current of 460 Arms and an output power of 0.55 MW.
  • Keywords
    "Insulation","Temperature measurement","Cooling","Coils","Medium voltage","Power supplies","Solids"
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2015 IEEE
  • ISSN
    2329-3721
  • Electronic_ISBN
    2329-3748
  • Type

    conf

  • DOI
    10.1109/ECCE.2015.7310295
  • Filename
    7310295