Implementation aspects of on-chip printed micro heat sinks for power semiconductors

In modern power semiconductor devices, the top side of the semiconductor is usually connected by bond wires. Thus top side cooling becomes impossible. This work presents the implementation and the thermal performance of a micro heat sink that allows effective fluid cooling of power semiconductors on both sides of the chip. The micro heat sink is printed directly onto the metalization of the silicon die using the Selective Laser Melting process. Hence, the amount of material transitions within the thermal path is drastically reduced. Finally, the impact of the production method on the silicon die is investigated.