• DocumentCode
    3691318
  • Title

    Non-contact carrier density measurement of semiconductor wafers by terahertz spectroscopic ellipsometry

  • Author

    T. Yamashita;M. Suga;T. Okada;A. Irisawa;M. Imamura

  • Author_Institution
    ADVANTEST Corporation, 48-2 Matsubara, Kamiayashi, Aoba-ku, Sendai, Miyagi 989-3124, Japan
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We developed a terahertz ellipsometry system that can measure the complex dielectric characteristics of doped semiconductors and evaluate the carrier density and mobility in a non-destructive, non-contact way. The system is constructed of optical-fiber pigtail-coupled terahertz emitter and detector, and delivers high measurement precision and stability. We demonstrated carrier-density measurement of n-type GaAs wafer and n-type SiC epitaxial film using this system, and confirmed a good agreement with conventional measurement methods.
  • Keywords
    "Semiconductor device measurement","Dielectric measurement","Optical variables measurement","Charge carrier density","Silicon carbide","Optical films"
  • Publisher
    ieee
  • Conference_Titel
    Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2015 40th International Conference on
  • ISSN
    2162-2027
  • Electronic_ISBN
    2162-2035
  • Type

    conf

  • DOI
    10.1109/IRMMW-THz.2015.7327471
  • Filename
    7327471