DocumentCode
3691318
Title
Non-contact carrier density measurement of semiconductor wafers by terahertz spectroscopic ellipsometry
Author
T. Yamashita;M. Suga;T. Okada;A. Irisawa;M. Imamura
Author_Institution
ADVANTEST Corporation, 48-2 Matsubara, Kamiayashi, Aoba-ku, Sendai, Miyagi 989-3124, Japan
fYear
2015
Firstpage
1
Lastpage
2
Abstract
We developed a terahertz ellipsometry system that can measure the complex dielectric characteristics of doped semiconductors and evaluate the carrier density and mobility in a non-destructive, non-contact way. The system is constructed of optical-fiber pigtail-coupled terahertz emitter and detector, and delivers high measurement precision and stability. We demonstrated carrier-density measurement of n-type GaAs wafer and n-type SiC epitaxial film using this system, and confirmed a good agreement with conventional measurement methods.
Keywords
"Semiconductor device measurement","Dielectric measurement","Optical variables measurement","Charge carrier density","Silicon carbide","Optical films"
Publisher
ieee
Conference_Titel
Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2015 40th International Conference on
ISSN
2162-2027
Electronic_ISBN
2162-2035
Type
conf
DOI
10.1109/IRMMW-THz.2015.7327471
Filename
7327471
Link To Document