• DocumentCode
    3691954
  • Title

    Highly effective and high throughput chipping monitor to prevent wafer cracking

  • Author

    C H Yen;Y L Fu;T S Lee;H T Lo;J Y Chang;Tim Peng;Henry Chen;Ray Huang

  • Author_Institution
    Taiwan Semiconductor Manufacturing Company(tsmc), 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 300-78, Taiwan, R.O.C.
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    During semiconductor manufacturing processes, wafer cracking inside a tool is a very serious problem in a fab. It results in costs from tool recovery, wafer and time loss, and potential contamination for other wafers. Most wafer cracking cases result from wafer edge chipping. A good chipping monitor solution will save more than 100 times the costs related to wafer cracking cases.
  • Keywords
    "Monitoring","Inspection","Image edge detection","Throughput","Manufacturing","Contamination","Yield estimation"
  • Publisher
    ieee
  • Conference_Titel
    Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM), 2015
  • Type

    conf

  • Filename
    7328914
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3691954