Title :
Preliminary steps towards implementing intimate 3D-IC stacking with layer transfer and atomic bonding methods
Author :
Michael I. Current;W. Łukaszek;Shari Farrens;T. Fong
Author_Institution :
Current Scientific, San Jose, CA
Abstract :
Preliminary studies of radiation damage and recovery of E2PROM sensor devices following exposure to a high-dose, 1 MeV proton beam give encouragement to the use of H-cut and layer transfer methods for vertical integration of 3D-IC´s with fully-formed CMOS devices and metal interconnect.
Keywords :
"Protons","Implants","CMOS integrated circuits","Threshold voltage","Annealing","Ionization","Particle beams"
Conference_Titel :
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015 IEEE
DOI :
10.1109/S3S.2015.7333519
