Title :
Power, performance, and cost comparisons of monolithic 3D ICs and TSV-based 3D ICs
Author :
Deepak Kumar Nayak;Srinivasa Banna;Sandeep Kumar Samal;Sung Kyu Lim
Author_Institution :
Technology Research, GLOBALFOUNDRIES, 2600 Great America Way, Santa Clara, CA 95054
Abstract :
Power, performance, area, and cost analysis of TSV, mini-TSV, and monolithic 3D ICs is presented. Power savings for TSV, mini-TSV, and monolithic 3D ICs are 21%, 25%, and 37%, respectively, compared to that of a 2D IC. It is shown that monolithic 3D can deliver one node PPC benefit, whereas TSV 3D or mini-TSV 3D can only achieve a half node PPC advantage.
Keywords :
"Three-dimensional displays","Logic gates","Cost benefit analysis","Very large scale integration","Layout"
Conference_Titel :
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015 IEEE
DOI :
10.1109/S3S.2015.7333538
