• DocumentCode
    3694881
  • Title

    Power, performance, and cost comparisons of monolithic 3D ICs and TSV-based 3D ICs

  • Author

    Deepak Kumar Nayak;Srinivasa Banna;Sandeep Kumar Samal;Sung Kyu Lim

  • Author_Institution
    Technology Research, GLOBALFOUNDRIES, 2600 Great America Way, Santa Clara, CA 95054
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Power, performance, area, and cost analysis of TSV, mini-TSV, and monolithic 3D ICs is presented. Power savings for TSV, mini-TSV, and monolithic 3D ICs are 21%, 25%, and 37%, respectively, compared to that of a 2D IC. It is shown that monolithic 3D can deliver one node PPC benefit, whereas TSV 3D or mini-TSV 3D can only achieve a half node PPC advantage.
  • Keywords
    "Three-dimensional displays","Logic gates","Cost benefit analysis","Very large scale integration","Layout"
  • Publisher
    ieee
  • Conference_Titel
    SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/S3S.2015.7333538
  • Filename
    7333538
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3694881