DocumentCode :
36957
Title :
Data-Driven Robust Design for a Curing Oven
Author :
Xinjiang Lu ; Han-Xiong Li ; Minghui Huang
Author_Institution :
State Key Lab. of High Performance Complex Manuf., Central South Univ., Changsha, China
Volume :
4
Issue :
8
fYear :
2014
fDate :
Aug. 2014
Firstpage :
1366
Lastpage :
1373
Abstract :
If no external control is employed, the cure performance will be fully dependent on the oven design. Design of such a system is challenging because of its inherent complexity: complex heat transfer, unknown relationship between design variable and curing performance, unknown boundary conditions and large parameter variation, and so on. In this paper, a novel data-based robust design approach is proposed to design a new curing oven with simple structure. First, a modeling method with hybrid singular value decomposition and response surface method is developed to extract the system model from experimental data. The coupling influence between design variable and model parameter is also separated to make the design simpler, because only the part affected by design variable will be considered in the design. A robust design method is then developed to minimize the influence of parameter variation on the performance. Finally, the effectiveness of the proposed method is demonstrated in the design of the new curing oven.
Keywords :
curing; heat transfer; ovens; product design; response surface methodology; singular value decomposition; curing oven; data-driven robust design; heat transfer; response surface method; singular value decomposition; Curing; Data models; Design methodology; Heat transfer; Heating; Ovens; Robustness; Design for manufacture; design methodology; semiconductor device manufacture; semiconductor device modeling; semiconductor device modeling.;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2014.2321131
Filename :
6825870
Link To Document :
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