DocumentCode
3695788
Title
3D advanced integration technology for heterogeneous systems
Author
Pascal Vivet;Christian Bernard;Fabien Clermidy;Denis Dutoit;Eric Guthmuller;Ivan-Miro Panadès;G. Pillonnet;Yvain Thonnart;Arnaud Garnier;Didier Lattard;Amandine Jouve;Franck Bana;Thierry Mourier;Séverine Chéramy
Author_Institution
Univ. Grenoble Alpes, CEA, LETI, MINATEC Campus, 38054, France
fYear
2015
Abstract
3D integration technology is nowadays mature enough, offering today further system integration using heterogeneous technologies, with already many different industrial successes (Imagers, 2.5D Interposers, 3D Memory Cube, etc.). CEA-LETI has been developing for a decade 3D integration, and have pursued research in both directions: developing advanced 3D technology bricks (TSVs, µ-bumps, Hybrid Bonding, etc), and designing advanced 3D circuits as pioneer prototypes. In this paper, a short overview of some recent advanced 3D technology results is presented, including some latest 3D circuit´s description.
Keywords
"Three-dimensional displays","Artificial intelligence","Stacking","Semiconductor device reliability","Thermal management"
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2015 International
Type
conf
DOI
10.1109/3DIC.2015.7334468
Filename
7334468
Link To Document