DocumentCode
3701581
Title
Table of contents
fYear
2015
Firstpage
7
Lastpage
13
Abstract
The following topics are dealt with: advanced electronics packaging; printed electronics; power electronics and microsystems packaging; electronic circuit design; electronics simulation & modelling; automotive electronics; optoelectronics & advanced communication packaging; applied reliability; and global education.
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2015 IEEE 21st International Symposium for
Type
conf
DOI
10.1109/SIITME.2015.7342285
Filename
7342285
Link To Document