• DocumentCode
    3701649
  • Title

    Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending

  • Author

    Nagarajan Palavesam;Detlef Bonfert;Waltraud Hell;Christof Landesberger;Horst Gieser;Christoph Kutter;Karlheinz Bock

  • Author_Institution
    Fraunhofer Research Institution for Modular Solid State Technologies EMFT, Hansastr. 27d, 80686 Munich, Germany
  • fYear
    2015
  • Firstpage
    367
  • Lastpage
    372
  • Abstract
    We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending machine was utilized to bend the test samples and the electrical resistance of the Daisy Chain structures were measured during the tests. Resistance measurements confirmed the failure of the test samples after about 2000 bending cycles.
  • Keywords
    "Electrical resistance measurement","Resistance","Stress","Performance evaluation","Assembly","Semiconductor device measurement","Aluminum"
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2015 IEEE 21st International Symposium for
  • Type

    conf

  • DOI
    10.1109/SIITME.2015.7342355
  • Filename
    7342355
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3701649