Title :
Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Author :
Nagarajan Palavesam;Detlef Bonfert;Waltraud Hell;Christof Landesberger;Horst Gieser;Christoph Kutter;Karlheinz Bock
Author_Institution :
Fraunhofer Research Institution for Modular Solid State Technologies EMFT, Hansastr. 27d, 80686 Munich, Germany
Abstract :
We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending machine was utilized to bend the test samples and the electrical resistance of the Daisy Chain structures were measured during the tests. Resistance measurements confirmed the failure of the test samples after about 2000 bending cycles.
Keywords :
"Electrical resistance measurement","Resistance","Stress","Performance evaluation","Assembly","Semiconductor device measurement","Aluminum"
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2015 IEEE 21st International Symposium for
DOI :
10.1109/SIITME.2015.7342355
