DocumentCode
37028
Title
300-GHz Step-Profiled Corrugated Horn Antennas Integrated in LTCC
Author
Tajima, Tsutomu ; Ho-Jin Song ; Ajito, K. ; Yaita, Makoto ; Kukutsu, Naoya
Author_Institution
NTT Device Technol. Labs., NTT Corp., Atsugi, Japan
Volume
62
Issue
11
fYear
2014
fDate
Nov. 2014
Firstpage
5437
Lastpage
5444
Abstract
This paper presents 300-GHz step-profiled corrugated horn antennas, aiming at their integration in low-temperature co-fired ceramic (LTCC) packages. Using substrate integrated waveguide technology, the cavity inside the multi-layer LTCC substrate and a surrounding via fence are used to form a feeding hollow waveguide and horn structure. Owing to the vertical configuration, we were able to design the corrugations and stepped profile of horn antennas to approximate smooth metallic surface. To verify the design experimentally, the LTCC waveguides and horn antennas were fabricated with an LTCC multi-layer process. The LTCC waveguide exhibits insertion loss of 0.6 dB/mm, and the LTCC horn antenna exhibits 18-dBi peak gain and 100-GHz bandwidth with more than 10-dB return loss. The size of the horn antenna is only 5×5×2.8 mm3, which makes it easy to integrate it in LTCC transceiver modules.
Keywords
ceramic packaging; horn antennas; substrate integrated waveguides; LTCC packages; LTCC transceiver modules; bandwidth 100 GHz; frequency 300 GHz; hollow waveguide; horn structure; low-temperature co-fired ceramic packages; step-profiled corrugated horn antennas; substrate integrated waveguide technology; Cavity resonators; Hollow waveguides; Horn antennas; Metals; Slot antennas; Substrates; Dielectric substrates; horn antennas; low-temperature co-fired ceramics (LTCC); terahertz (THz);
fLanguage
English
Journal_Title
Antennas and Propagation, IEEE Transactions on
Publisher
ieee
ISSN
0018-926X
Type
jour
DOI
10.1109/TAP.2014.2350520
Filename
6880791
Link To Document