Title :
A study to improve IGBT reliability in power electronics applications
Author :
Vinoth Kumar Sundaramoorthy;Enea Bianda;Gernot J?rgen Riedel
Author_Institution :
Corporate Research, ABB Switzerland Ltd, Segelhofstrasse 1K, 5405 Baden, Switzerland
Abstract :
Lifetime prediction of IGBT modules from their junction temperature is an important aspect to improve the reliability of power electronic systems. Here, methods to estimate the IGBT junction temperature from its electrical characteristics are discussed. A solution is also proposed to avoid explosion of IGBTs used in traction converters.
Keywords :
"Temperature measurement","Insulated gate bipolar transistors","Time measurement","Semiconductor device measurement","Estimation","Voltage measurement","Logic gates"
Conference_Titel :
Semiconductor Conference (CAS), 2015 International
Print_ISBN :
978-1-4799-8862-4
DOI :
10.1109/SMICND.2015.7355149
