• DocumentCode
    3713076
  • Title

    Novel PCB fabrication process roughness free for high frequency applications.

  • Author

    P?rez-Fajardo Abel.;Torres-Jacome Alfonso;Torres-Torres Reydezel

  • Author_Institution
    Electronics department, Instituto Nacional de Astrof?sica, ?ptica y Electr?nica, Puebla, M?xico
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In this work, a new process for Print Circuit Board (PCB) fabrication is introduced. It is so far one of the lowest losses PCB fabrication process, for high frequency operation. Instead of a rigged surface for adhesion of the metal, a plasma process is used on homogeneous and polished surface of Teflon as substrate. For demonstrating the capability of this proposal, a microstrip is built and resulted with attenuation of a 2 Np/m at 20 GHz, loses were obtained from measurements from S-parameters.
  • Keywords
    "Microstrip","Fabrication","Surface treatment","Copper","Rough surfaces","Surface roughness","Substrates"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Engineering, Computing Science and Automatic Control (CCE), 2015 12th International Conference on
  • Type

    conf

  • DOI
    10.1109/ICEEE.2015.7357904
  • Filename
    7357904
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3713076