• DocumentCode
    3713294
  • Title

    EMC performance analysis of a processor/memory system using PCB and Package-On-Package

  • Author

    Etienne Sicard;Alexandre Boyer;Priscila Fernandez-Lopez;An Zhou;Nicolas Marier;Fr?d?ric Lafon

  • Author_Institution
    INSA, University of Toulouse, 135 av. de Rangueil, 31077, France
  • fYear
    2015
  • Firstpage
    238
  • Lastpage
    243
  • Abstract
    In this paper, the signal integrity (SI) and Electromagnetic Compatibility (EMC) performance of System-On-Chip (SoC) and stacked memory using Package-On-Package (PoP) technology is investigated. The reconfiguration of the IC-EMC software platform to PoP is described. From an existing 2D assembly using a discrete 65-nm SoC product, the benefits of PoP integration using a next-generation (NG) 28-nm product with stacked memory are analyzed, based on simulation and predictive analysis performed using IC-EMC software platform.
  • Keywords
    "Electromagnetic compatibility","Integrated circuit modeling","Bonding","Pins","Analytical models","Magnetic field measurement"
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 10th International Workshop on the
  • Type

    conf

  • DOI
    10.1109/EMCCompo.2015.7358364
  • Filename
    7358364
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3713294