• DocumentCode
    3718345
  • Title

    Simulation studies on bipolar electrostatic chucks

  • Author

    Chih-Hung Li; Yi-Fan Chiu; Yi-Hsiuan Yu; Jian-Zhang Chen

  • Author_Institution
    Graduate Institute of Applied Mechanics, National Taiwan University, Taipei City 10617, Taiwan
  • fYear
    2015
  • Firstpage
    382
  • Lastpage
    385
  • Abstract
    We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated.
  • Keywords
    "Substrates","Clamps","Force","Electrostatics","Dielectric constant","Atmospheric modeling"
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
  • Print_ISBN
    978-1-4673-9690-5
  • Type

    conf

  • DOI
    10.1109/IMPACT.2015.7365233
  • Filename
    7365233
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3718345