A new reliable adhesion enhancement process for directly plating on molding compounds for package level EMI shielding

Plating on molding compound is a relatively new field which could open up new package designs. One major application is conformal self EMI shielding (package level shielding) of ICs. Generally, EMI shielding is done mainly by metallic cans, however, this technique increases the space requirements and reduces flexibility of component layout on the PCB, that would not be suitable to handset products.