Next generation Copper electroplating for HDI micro-via filling and through hole plating

A novel DC blind micro via filling process was formulated for high volume HDI and substrate core layer metallization production. The process yields high quality results over a wide current density range. The process will be commercialized and it is anticipated that there will be substantial future growth in adoption of this technology to fill blind micro vias. This new chemistry in combination with optimized plating conditions and plating equipment can fill blind micro vias of various geometries. The plated copper has excellent physical and mechanical properties with a mirror bright surface. This formulation is intended to be used with either vertical or horizontal in-line jet impingement equipment in both panel and pattern modes. All organic additives can be easily monitored and controlled by conventional CVS analysis techniques.