• DocumentCode
    3727428
  • Title

    High-speed III-V devices for millimeter-wave receiver applications (Invited)

  • Author

    Tsuyoshi Takahashi;Masaru Sato;Kozo Makiyama;Yasuhiro Nakasha;Naoki Hara;Taisuke Iwai;Tsuyoshi Takahashi;Masaru Sato;Kozo Makiyama;Yasuhiro Nakasha;Naoki Hara

  • Author_Institution
    Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0197, Japan
  • fYear
    2015
  • Firstpage
    238
  • Lastpage
    240
  • Abstract
    We developed high-speed III-V devices for millimeter-wave receiver applications as InP-based high electron mobility transistors (HEMTs) that had a cavity structure and zero-bias GaAsSb-based heterojunction backward diodes. A high cutoff frequency (fT) of 517 GHz and minimum noise figure (NFmin) of 0.71 dB at 94 GHz were achieved for the InP-based HEMTs, even after the passivation process, by adopting the cavity structure. Since GaAsSb-based diodes that are based on p+-GaAsSb/i-InAlAs/n-InGaAs are mostly lattice-matched to InP, they can be easily integrated with InP-based low-noise amplifiers (LNAs). They indicated a sensitivity of 20,400 V/W at 94 GHz. By integrating the backward diodes with LNAs, highly sensitive receiver MMICs can be fabricated.
  • Keywords
    "Cavity resonators","HEMTs","Schottky diodes","MODFETs","Logic gates","Receivers","MMICs"
  • Publisher
    ieee
  • Conference_Titel
    Radio-Frequency Integration Technology (RFIT), 2015 IEEE International Symposium on
  • Type

    conf

  • DOI
    10.1109/RFIT.2015.7377946
  • Filename
    7377946