• DocumentCode
    37275
  • Title

    AC Power Losses Model for Planar Windings With Rectangular Cross-Sectional Conductors

  • Author

    Lope, Ignacio ; Carretero, Claudio ; Acero, Jesus ; Alonso, Rafael ; Burdio, Jose M.

  • Author_Institution
    Dept. de Ing. Electron. y Comun., Univ. de Zaragoza, Zaragoza, Spain
  • Volume
    29
  • Issue
    1
  • fYear
    2014
  • fDate
    Jan. 2014
  • Firstpage
    23
  • Lastpage
    28
  • Abstract
    In this letter, a method to calculate the ac losses, including skin effect and proximity losses, in planar windings with rectangular cross-sectional conductors is proposed. The aim is proposing proper ac losses expressions similar to the formulas available for round cross-sectional wires, to be used for the calculation of the ac losses and the optimization of planar magnetic windings implemented in the printed circuit board. The proposed model is based on the decomposition into conduction and proximity losses. Conduction losses only depend on the properties of the conductor, whereas proximity losses are calculated by using the orthogonal decomposition of the magnetic fields in which the conductors are immersed. Functions including the frequency and geometrical dependences of the both types of losses are extracted by means of finite element method simulation. Finally, several prototypes are used to verify the proposed expressions and some design considerations are also outlined.
  • Keywords
    conductors (electric); decomposition; finite element analysis; losses; magnetic devices; magnetic fields; printed circuits; skin effect; windings; AC power loss model; conduction loss; finite element method simulation; magnetic field orthogonal decomposition; optimization; planar magnetic winding; printed circuit board; proximity loss; rectangular cross-sectional conductor; round cross-sectional wire; skin effect; Electromagnetic modeling; frequency-dependent impedance; passive components; printed circuits;
  • fLanguage
    English
  • Journal_Title
    Power Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8993
  • Type

    jour

  • DOI
    10.1109/TPEL.2013.2256928
  • Filename
    6508936