DocumentCode
3731723
Title
Plating impacts on transmission characteristics of high-speed interface connectors
Author
Taegyu Bae;Tae-Wan Koo;Jong-Gwan Yook;Myung-Hyun Park
Author_Institution
Dept. Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea
fYear
2015
Firstpage
189
Lastpage
192
Abstract
Plating on conductive compositions of an electrical connector for high-speed digital interfaces is generally implemented into production process to satisfy some mechanical or chemical reasons. In this paper, pins of connector are plated by various ways, and their impacts on performance of signal are investigated by three dimensional electromagnetic field solver. In addition, some alternatives for conventional plating are presented.
Keywords
"Plating","Pins","Nickel","Harmonic analysis","Skin","Conductors"
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
Type
conf
DOI
10.1109/EDAPS.2015.7383707
Filename
7383707
Link To Document