DocumentCode :
3735706
Title :
A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics
Author :
Aarief Syed-Khaja;Johannes Hoerber;Christopher Gruber;Joerg Franke
Author_Institution :
Friedrich-Alexander-Universit?t Erlangen-N?rnberg, Institute for Factory Automation and Production Systems (FAPS), N?rnberg, Germany
fYear :
2015
Firstpage :
1
Lastpage :
6
Abstract :
The growing demand for highly reliable and compact power electronic modules capable of operating at high switching frequencies and temperatures require optimized interconnection and packaging technologies. This holds true also for conventional electronics for usage at elevated temperatures, which allows additional options for miniaturization and high system integration without complicated cooling concepts. However, new materials and cost-effective manufacturing concepts are required. This contribution introduces a modified approach to produce thin-film silver sintered interconnections through Aerosol Jet Printing (AJP), which offers high degree of customization and design flexibility. The sintering process for silver nano-inks through AJP for power electronic die-attach has been introduced. Power electronic assemblies had been constructed and high-temperature shear tests up to 400°C had been performed to demonstrate the potential of the realized thin-film silver joints.
Keywords :
"Printing","Ink","Silver","Substrates","Power electronics","Silicon","Aerosols"
Publisher :
ieee
Conference_Titel :
Microelectronics Packaging Conference (EMPC), 2015 European
Type :
conf
Filename :
7390729
Link To Document :
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