• DocumentCode
    3737
  • Title

    Fast {cal H} -Matrix-Based Direct Integral Equation Solver With Reduced Computational Cost for Large-Scale Interconnect Extraction

  • Author

    Wenwen Chai ; Dan Jiao

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    3
  • Issue
    2
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    289
  • Lastpage
    298
  • Abstract
    In this paper, we propose a fast H-matrix-based direct solution with a significantly reduced computational cost for an integral-equation-based capacitance extraction of large-scale 3-D interconnects in multiple dielectrics. We reduce the computational cost of an H-matrix-based computation by simultaneously optimizing the H-matrix partition to minimize the number of matrix blocks and minimizing the rank of each matrix block based on a prescribed accuracy. With the proposed cost-reduction method, we develop a fast LU-based direct solver. This solver possesses a complexity of kCspO (NlogN) in storage, a complexity of k2Csp2O(Nlog2N) in LU factorization, and a complexity of kCspO(NlogN) in LU solution, where k is the maximal rank, Csp is a constant dependent on matrix partition, and the constant kCsp is minimized based on accuracy by the proposed cost-reduction method. The proposed solver successfully factorizes dense matrices that involve millions of unknowns in fast CPU time and modest memory consumption, and with the prescribed accuracy satisfied. As an algebraic method, the underlying fast technique is kernel independent.
  • Keywords
    dielectric materials; integral equations; integrated circuit interconnections; large scale integration; matrix algebra; CPU time; H-matrix partition; LU factorization; LU-based direct solver; algebraic method; capacitance extraction; cost-reduction; fast H-matrix-based direct integral equation solver; large-scale 3D interconnects; large-scale interconnect extraction; matrix blocks; memory consumption; multiple dielectrics; reduced computational cost; Accuracy; Capacitance; Complexity theory; Computational efficiency; Dielectrics; Memory management; Partitioning algorithms; ${cal H}$ matrix; capacitance extraction; direct solvers; fast integral equation solvers; interconnect extraction; multiple dielectrics;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2228003
  • Filename
    6407947