• DocumentCode
    37404
  • Title

    Reconfigurable Computing, 3D Integration, and Recognizing Leaders in our Field

  • Author

    Altman, Erik R.

  • Author_Institution
    Thomas J. Watson Research Center
  • Volume
    34
  • Issue
    1
  • fYear
    2014
  • fDate
    Jan.-Feb. 2014
  • Firstpage
    2
  • Lastpage
    3
  • Abstract
    This column discusses the special issue on reconfigurable computing, Micro´s current calls for papers, topics from the recent business meeting, and recent computer architecture award winners.
  • Keywords
    3D silicon integration; B. Ramakrishna Rau award; FPGA; ISCA most influential paper award; Maurice Wilkes award; TSVs; big data; harsh systems; high-speed data center interconnects; mobile systems; reconfigurable computing;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/MM.2014.26
  • Filename
    6774352
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=37404