Study of thermal characteristics of high-power semiconductor laser

The thermal characteristics of high-power semiconductor lasers can make full impact on its many performances. Analysis and research of thermal is the important research topics to improve the device power and increase the device lifetime and so on. Based on theory of thermal characteristics of semiconductor laser, this paper established the model of single chip semiconductor laser of installing patch and inversion patch, analyzed the relationship between the temperature of chip active region and the common packaging heat sink material that its size is smaller than normal in steady-state by ANSYS software. And the variable regularity of temperature of packaging chip in different parameters of heat sink was obtained.