Gate-sided hydrogen release as the origin of "permanent" NBTI degradation: From single defects to lifetimes

The negative bias temperature instability (NBTI) in pMOS transistors is typically assumed to consist of a recoverable (R) and a so-called permanent (P) component. While R has been studied in great detail, the investigation of P is much more difficult due to the large time constants involved and the fact that P is almost always obscured by R. As such, it is not really clear how to measure P and whether it will in the end dominate device lifetime. We address these questions by introducing a pragmatic definition of P, which allows us to collect long-term data on both large and nanoscale devices. Our results suggest that (i) P is considerably smaller than R, (ii) that P is dominated by oxide rather than interface traps and therefore (iii) shows a very similar bias dependence as R, and finally (iv) that P is unlikely to dominate device lifetime. We argue that a hydrogen-release mechanism from the gate-side of the oxide, which has been suspected to cause reliability problems for a long time [1-6], is consistent with our data. Based on these results as well as our density-functional-theory (DFT) calculations we suggest a microscopic model to project the results to operating conditions.